[산업/전자] 하이졸 Hysol ECCOBOND 281 에폭시 일액형 열경화 전도성 에폭시 접착제
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Hysol ECCOBOND 281 |
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Chemical Type |
Epoxy |
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Appearance |
Black thixotropic paste |
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Cure |
Heat cure |
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Product Benefits |
● One component ● High thermal conductivity ● Non-sag paste ● Thixotropic ● Good chemical resistance ● High electrical insulation ● Low coefficient of thermal expansion |
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Application |
Assembly |
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Operating Temperature |
-55 to +180 °C |
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Key Substrates |
Metals , Glass and Plastics |