[산업] Hysol FP6101 'Unfilled Flexible Epoxy' CSP/BGA Underfill - 언더필 CSP/BGA
에폭시 TDS
·
Arirang chemical co. /Korea
FP6101 provides the following product characteristics:
Technology : Epoxy
Appearance : Black
Product Benefits :
? Reworkable
? High flow
? High adhesion to flexible and rigid substrates
? Low modulus
? Low stress
Components : One-component
Cure : Heat cure
Application : CSP/BGA Underfill