Ultra High Temperature

526N Clear-Amber, 1:1 two-part System for Tough Bonding Applications.

570 One-part Contact Adhesive, Excellent Flexibility.

805 Aluminum-Filled, Low Shrinkage, High Thermal Conductivity, For Bonding and Molding Applications.

2330 One-part, Heat Curable, Silicone Elastomer Adhesive.

High Temperature, Special Purpose

568 Aluminum-Filled, 1:1 two-part, Good Bond Strength and High Thermal Conductivity.

631 Clear-Amber, 1:1 two-part, Good Bond Strength and Corrosion Resistance.

657 Stainless Steel-Filled, 1:1 two-part, High Corrosion Resistance.

807 10 Minute Set, Non-Sagging, 1:1 two-part, Excellent Electrical & Mechanical Properties.

820 Clear, 1:1 two-part, 45-Minute Cure System with Good Flexibility.

2150 Ceramic-Filled, Fast-Setting, High Vibration Resistance and Bond Strength. Ideal For Ceramic Wear Tiles.

2315 High Temperature, Thermally Conductive, Low Viscosity, Potting Compound for Electrical Applications.

2318 High Temperature, Low Viscosity, Room Temp Curing Potting Compound.

High Temperature, Maintenance and Repair

2200 Kevlar-Reinforced, Epoxy-Novolac, High Strength, Excellent Abrasion and Corrosion Resistance.

2210 Aluminum and Ceramic-Filled, Vibration and Impact Resistant, For Aluminum Mold and Wear Surfaces.

2220 Ceramic-Filled, High Chemical Resistance, Machinable, For Repairing Deeply-Corroded Parts.

Ultra High Bond Strength

2300 Milky Clear, 10:1, Low Viscosity, Exceptional Bond Strength.

2310 Ceramic-Filled, 1:1 two-part, High Lap Shear and Peel Strength, Autoclavable.